Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC / Er-Ping Li.
Material type:
TextPublisher: [United States] : Hoboken [New Jersey] : IEEE Press ; Wiley, Distributor: [Piscataqay, New Jersey] : IEEE Xplore, [2012]Description: 1 PDF (224 pages)Content type: - text
- electronic
- online resource
- 9781118166727
- Three-dimensional integrated circuits
- Admittance
- Copper
- Electromagnetic compatibility
- Electromagnetics
- Equations
- Equivalent circuits
- Etching
- Fabrication
- Frequency domain analysis
- Function approximation
- Impedance
- Indexes
- Integral equations
- Integrated circuit interconnections
- Integrated circuit modeling
- Mathematical model
- Microwave circuits
- Packaging
- Power transmission lines
- Printed circuits
- Scattering
- Silicon
- Simulation
- Solid modeling
- System-on-a-chip
- Three dimensional displays
- Through-silicon vias
- Transmission line matrix methods
- 621.3815
Includes index.
Includes bibliographical references and index.
Macromodeling of Complex Interconnects in 3D Integration -- 2.5D Simulation Method for 3D Integrated Systems -- Hybrid Integral Equation Modeling Methods for 3D Integration -- Systematic Microwave Network Analysis for 3D Integrated Systems -- Modeling of Through-Silicon Vias (TSV) in 3D Integration.
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