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Electrical modeling and design for 3D system integration : (Record no. 40489)

MARC details
000 -LEADER
fixed length control field	03075nam a2200817 i 4500
001 - CONTROL NUMBER
control field	6183551
003 - CONTROL NUMBER IDENTIFIER
control field	IEEE
005 - DATE AND TIME OF LATEST TRANSACTION
control field	20230927112354.0
006 - FIXED-LENGTH DATA ELEMENTS--ADDITIONAL MATERIAL CHARACTERISTICS
fixed length control field	m o d
007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION
fixed length control field	cr \|n\|\|\|\|\|\|\|\|\|
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field	151221s2012 nju ob 001 eng d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number	9781118166727
Qualifying information	ebook
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
Canceled/invalid ISBN	1118166728
Qualifying information	electronic
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
Canceled/invalid ISBN	0470623462
Qualifying information	hardback
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
Canceled/invalid ISBN	9780470623466
Qualifying information	print
024 8# - OTHER STANDARD IDENTIFIER
Standard number or code	9786613650047
035 ## - SYSTEM CONTROL NUMBER
System control number	(CaBNVSL)mat06183551
035 ## - SYSTEM CONTROL NUMBER
System control number	(IDAMS)0b000064817eb439
040 ## - CATALOGING SOURCE
Original cataloging agency	CaBNVSL
Language of cataloging	eng
Description conventions	rda
Transcribing agency	CaBNVSL
Modifying agency	CaBNVSL
082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER
Classification number	621.3815
100 1# - MAIN ENTRY--PERSONAL NAME
Personal name	Li, Er-Ping,
Relator term	author.
245 10 - TITLE STATEMENT
Title	Electrical modeling and design for 3D system integration :
Remainder of title	3D integrated circuits and packaging, signal integrity, power integrity and EMC /
Statement of responsibility, etc.	Er-Ping Li.
264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE
Place of production, publication, distribution, manufacture	[United States] :
Name of producer, publisher, distributor, manufacturer	IEEE Press ;
Place of production, publication, distribution, manufacture	Hoboken [New Jersey] :
Name of producer, publisher, distributor, manufacturer	Wiley,
264 #2 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE
Place of production, publication, distribution, manufacture	[Piscataqay, New Jersey] :
Name of producer, publisher, distributor, manufacturer	IEEE Xplore,
Date of production, publication, distribution, manufacture, or copyright notice	[2012]
300 ## - PHYSICAL DESCRIPTION
Extent	1 PDF (224 pages).
336 ## - CONTENT TYPE
Content type term	text
Source	rdacontent
337 ## - MEDIA TYPE
Media type term	electronic
Source	isbdmedia
338 ## - CARRIER TYPE
Carrier type term	online resource
Source	rdacarrier
500 ## - GENERAL NOTE
General note	Includes index.
504 ## - BIBLIOGRAPHY, ETC. NOTE
Bibliography, etc. note	Includes bibliographical references and index.
505 0# - FORMATTED CONTENTS NOTE
Formatted contents note	Macromodeling of Complex Interconnects in 3D Integration -- 2.5D Simulation Method for 3D Integrated Systems -- Hybrid Integral Equation Modeling Methods for 3D Integration -- Systematic Microwave Network Analysis for 3D Integrated Systems -- Modeling of Through-Silicon Vias (TSV) in 3D Integration.
506 1# - RESTRICTIONS ON ACCESS NOTE
Terms governing access	Restricted to subscribers or individual electronic text purchasers.
530 ## - ADDITIONAL PHYSICAL FORM AVAILABLE NOTE
Additional physical form available note	Also available in print.
538 ## - SYSTEM DETAILS NOTE
System details note	Mode of access: World Wide Web
588 ## - SOURCE OF DESCRIPTION NOTE
Source of description note	Description based on PDF viewed 12/21/2015.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element	Three-dimensional integrated circuits.
655 #0 - INDEX TERM--GENRE/FORM
Genre/form data or focus term	Electronic books.
695 ## -
--	Admittance
695 ## -
--	Copper
695 ## -
--	Electromagnetic compatibility
695 ## -
--	Electromagnetics
695 ## -
--	Equations
695 ## -
--	Equivalent circuits
695 ## -
--	Etching
695 ## -
--	Fabrication
695 ## -
--	Frequency domain analysis
695 ## -
--	Function approximation
695 ## -
--	Impedance
695 ## -
--	Indexes
695 ## -
--	Integral equations
695 ## -
--	Integrated circuit interconnections
695 ## -
--	Integrated circuit modeling
695 ## -
--	Mathematical model
695 ## -
--	Microwave circuits
695 ## -
--	Packaging
695 ## -
--	Power transmission lines
695 ## -
--	Printed circuits
695 ## -
--	Scattering
695 ## -
--	Silicon
695 ## -
--	Simulation
695 ## -
--	Solid modeling
695 ## -
--	System-on-a-chip
695 ## -
--	Three dimensional displays
695 ## -
--	Through-silicon vias
695 ## -
--	Transmission line matrix methods
710 2# - ADDED ENTRY--CORPORATE NAME
Corporate name or jurisdiction name as entry element	IEEE Xplore (Online Service),
Relator term	distributor.
710 2# - ADDED ENTRY--CORPORATE NAME
Corporate name or jurisdiction name as entry element	Wiley InterScience (Online service),
Relator term	publisher.
776 08 - ADDITIONAL PHYSICAL FORM ENTRY
Relationship information	Print version:
International Standard Book Number	9780470623466
856 42 - ELECTRONIC LOCATION AND ACCESS
Materials specified	Abstract with links to resource
Uniform Resource Identifier	<a href="https://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551">https://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551</a>

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