000			08513nam a2200949 i 4500
001			7748309
003			IEEE
005			20230927112358.0
006			m o d
007			cr |n|||||||||
008			170118s2016 nju ob 001 eng d
010			_z 2016007834 (print)
020			_a9781119011965 _qelectronic
020			_z9780470907238 _qcloth
020			_z9781119011941 _qAdobe PDF
020			_z9781119011958 _qePub
024	7		_a10.1002/9781119011965 _2doi
035			_a(CaBNVSL)mat07748309
035			_a(IDAMS)0b0000648584e77b
040			_aCaBNVSL _beng _erda _cCaBNVSL _dCaBNVSL
082	0	0	_a671.5/6
100	1		_aKato, Takahiko, _eauthor.
245	1	0	_aMitigating tin whisker risks : _btheory and practice / _cTakahiko Kato, Carol A. Handwerker, Jasbir Bath.
264		1	_aHoboken, New Jersey : _bJohn Wiley & Sons, Inc., _c[2016]
264		2	_a[Piscataqay, New Jersey] : _bIEEE Xplore, _c[2016]
300			_a1 PDF (272 pages).
336			_atext _2rdacontent
337			_aelectronic _2isbdmedia
338			_aonline resource _2rdacarrier
490	1		_aWiley series on processing of engineering materials
504			_aIncludes bibliographical references and index.
505	0		_aList of Contributors ix -- Introduction xi -- 1 A Predictive Model for Whisker Formation Based on Local Microstructure and Grain Boundary Properties 1 /Pylin Sarobol, Ying Wang, Wei-Hsun Chen, Aaron E. Pedigo, John P. Koppes, John E. Blendell and Carol A. Handwerker -- 1.1 Introduction, 1 -- 1.2 Characteristics of Whisker and Hillock Growth from Surface Grains, 3 -- 1.3 Summary and Recommendations, 17 -- Acknowledgments, 18 -- References, 19 -- 2 Major Driving Forces and Growth Mechanisms for TinWhiskers 21 /Eric Chason and Nitin Jadhav -- 2.1 Introduction, 21 -- 2.2 Understanding the Mechanisms Behind Imc-Induced Stress Evolution and Whisker Growth, 24 -- 2.3 Relation of Stress to Whisker Growth, 34 -- 2.4 Conclusions, 39 -- Acknowledgments, 40 -- References, 40 -- 3 Approaches of Modeling and Simulation of Stresses in Sn Finishes 43 /Peng Su and Min Ding -- 3.1 Introduction, 43 -- 3.2 Constitutive Model, 44 -- 3.3 Strain Energy Density, 46 -- 3.4 Grain Orientation, 46 -- 3.5 Finite Element Modeling of Triple-Grain Junction, 48 -- 3.6 Finite Element Modeling of Sn Finish with Multiple Grains, 55 -- References, 66 -- 4 Properties and Whisker Formation Behavior of Tin-Based Alloy Finishes 69 /Takahiko Kato and Asao Nishimura -- 4.1 Introduction, 69 -- 4.2 General Properties of Tin-based Alloy Finishes (Asao Nishimura), 70 -- 4.3 Effect of Alloying Elements on Whisker Formation and Mitigation (Asao Nishimura), 75 -- 4.4 Dependence of Whisker Propensity of Matte Tin / Copper Finish on Copper Lead-Frame Material (Takahiko Kato), 89 -- 4.5 Conclusions, 118 -- Acknowledgments, 118 -- References, 119 -- 5 Characterization Techniques for Film Characteristics 125 /Takahiko Kato and Yukiko Mizuguchi -- 5.1 Introduction, 125 -- 5.2 TEM (Takahiko Kato), 125 -- 5.3 SEM (Yukiko Mizuguchi), 140 -- 5.4 EBSD (Yukiko Mizuguchi), 146 -- 5.5 Conclusions, 154 -- Acknowledgments, 155 -- References, 155 -- 6 Overview of Whisker-Mitigation Strategies for High-Reliability Electronic Systems 159 /David Pinsky.
505	8		_a6.1 Overview of Tin Whisker Risk Management, 159 -- 6.2 Details of Tin Whisker Mitigation, 164 -- 6.3 Managing Tin Whisker Risks at the System Level, 173 -- 6.4 Control of Subcontractors and Suppliers, 183 -- 6.5 Conclusions, 185 -- References, 185 -- 7 Quantitative Assessment of Stress Relaxation in Tin Films by the Formation of Whiskers, Hillocks, and Other Surface Defects 187 /Nicholas G. Clore, Dennis D. Fritz, Wei-Hsun Chen, Maureen E. Williams, John E. Blendell and Carol A. Handwerker -- 7.1 Introduction, 187 -- 7.2 Surface-Defect Classification and Measurement Method, 189 -- 7.3 Preparation and Storage Conditions of Electroplated Films on Substrates, 194 -- 7.4 Surface Defect Formation as a Function of Tin Film Type, Substrate, and Storage Condition, 195 -- 7.5 Conclusions, 209 -- Appendix, 209 -- Acknowledgments, 209 -- References, 213 -- 8 Board Reflow Processes and their Effect on Tin Whisker Growth 215 /Jasbir Bath -- 8.1 Introduction, 215 -- 8.2 The Effect of Reflowed Components on Tin Whisker Growth in Terms of Grain Size and Grain Orientation Distribution, 215 -- 8.3 Reflow Profiles and the Effect on Tin Whisker Growth, 216 -- 8.4 Influence of Reflow Atmosphere and Flux on Tin Whisker Growth, 219 -- 8.5 Effect of Solder Paste Volume on Component Tin Whisker Growth during Electronics Assembly, 220 -- 8.6 Conclusions, 221 -- Acknowledgments, 222 -- References, 222 -- 9 Mechanically Induced TinWhiskers 225 /Tadahiro Shibutani and Michael Osterman -- 9.1 Introduction, 225 -- 9.2 Overview of Mechanically Induced Tin Whisker Formation, 227 -- 9.3 Theory, 228 -- 9.4 Case Studies, 237 -- 9.5 Conclusions, 245 -- References, 246 -- Index 249.
506	1		_aRestricted to subscribers or individual electronic text purchasers.
520			_aDiscusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. . Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distribution. Examines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB). Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD). Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.
530			_aAlso available in print.
538			_aMode of access: World Wide Web
588			_aDescription based on PDF viewed 01/18/2017.
650		0	_aSolder and soldering.
650		0	_aFailure analysis (Engineering)
655		0	_aElectronic books.
695			_aCoatings
695			_aCompressive stress
695			_aConnectors
695			_aContacts
695			_aCreep
695			_aCrystals
695			_aDiffraction
695			_aElectrodes
695			_aEnergy resolution
695			_aFilms
695			_aFinite element analysis
695			_aGeometry
695			_aGrain boundaries
695			_aGrain size
695			_aLead
695			_aLength measurement
695			_aMicrostructure
695			_aPlating
695			_aRisk management
695			_aSoldering
695			_aStandards
695			_aStrain
695			_aStress
695			_aStress measurement
695			_aSubstrates
695			_aSurface morphology
695			_aSurface treatment
695			_aTemperature measurement
695			_aTemperature sensors
695			_aTesting
695			_aThermal expansion
695			_aTin
700	1		_aHandwerker, Carol A., _eauthor.
700	1		_aBath, Jasbir, _eauthor.
710	2		_aIEEE Xplore (Online Service), _edistributor.
710	2		_aWiley, _epublisher.
776	0	8	_iPrint version: _z9780470907238
830		0	_aWiley series on processing of engineering materials
856	4	2	_3Abstract with links to resource _uhttps://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=7748309
999			_c40734 _d40734