| 000 | 07831nam a2201525 i 4500 | ||
|---|---|---|---|
| 001 | 5270476 | ||
| 003 | IEEE | ||
| 005 | 20230927112347.0 | ||
| 006 | m o d | ||
| 007 | cr |n||||||||| | ||
| 008 | 100317t20152001nyua ob 001 0 eng d | ||
| 020 |
_a9780470544051 _qelectronic |
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| 020 |
_z9780780360259 _qprint |
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| 020 |
_z0470544058 _qelectronic |
||
| 024 | 7 |
_a10.1109/9780470544051 _2doi |
|
| 035 | _a(CaBNVSL)mat05270476 | ||
| 035 | _a(IDAMS)0b000064810cbddb | ||
| 040 |
_aCaBNVSL _beng _erda _cCaBNVSL _dCaBNVSL |
||
| 082 | 0 | 4 | _a620/.00452 |
| 082 | 0 | 4 | _a658.5/7 |
| 245 | 0 | 0 |
_aAccelerated stress testing handbook : _bguide for achieving quality products / _cedited by H. Anthony Chan, Paul J. Englert. |
| 264 | 1 |
_aNew York : _bIEEE Press, _cc2001. |
|
| 264 | 2 |
_a[Piscataqay, New Jersey] : _bIEEE Xplore, _c[2009] |
|
| 300 |
_a1 PDF (xxii, 372 pages) : _billustrations. |
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| 336 |
_atext _2rdacontent |
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| 337 |
_aelectronic _2isbdmedia |
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| 338 |
_aonline resource _2rdacarrier |
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| 504 | _aIncludes bibliographical references (p. 340-363) and index. | ||
| 505 | 0 | _aForeword (F. Ianna). Preface. Acknowledgments. OVERVIEW. Introduction (H. Chan and P. Englert). Principles of Stress Testing (H. Chan and P. Englert). PROCESS AND GUIDELINES. Stress Testing Program: Generic Processes (H. Chan and P. Englert). Stress Testing Program Subprocesses (H. Chan and P. Englert). Guidelines for Design and Manufacturing Stress Testing (H. Chan and P. Englert). THEORY. Economic and Optimization (H. Chan and P. Englert). Reliability Growth (C. Seusy). Overview of the Failure Analysis Process for Electrical Components (G. Pfeiffer). EQUIPMENT AND TECHNIQUES. Accelerated Stress Testing Equipment and Techniques (C. Felkins). Vibration and Shock Inputs Identify Some Failure Modes (W. Tustin). Relative Effectiveness of Thermal Cycling Versus Burn-In (K. Lo and F. LoVasco). Accelerated Qualification of Electronic Assemblies Under Combined Temperature Cycling and Vibration Environments: Is Miner's Hypothesis Valid (K. Upadhyayula and A. Dasgupta)? Liquid Environmental Stress Testing (LEST) (P. Englert). Safety Qualification of Stress Testing (S. Rajaram). BEST PRACTICES CASE STUDIES IN COMPUTER, COMMUNICATIONS, AND OTHER INDUSTRIES. Production Ast with Computers Using the Taguchi Method (D. Pachuki). Design Ast with Vendor Electronics (C. Schinner). Design and Production Ast with Power Supplies (D. Dalland). Design and Production Ast with Computers (E. Kyser). Qualifications and Production Sampling Ast with Printed Circuit Boards (H. McLean). Manufacturing Ast with Telecommunication Products (T. Parker and G. Harrison). Production Ast with Computer Disks. Benchmarking (H. Malec). Glossary of Stress Testing Terminology. Bibliography. Index. Epilogue. About the Editors. | |
| 506 | 1 | _aRestricted to subscribers or individual electronic text purchasers. | |
| 520 | _aAs we move closer to a genuinely global economy, the pressure to develop highly reliable products on ever-tighter schedules will increase. Part of a designer's "toolbox" for achieving product reliability in a compressed time frame should be a set of best practices for utilizing accelerated stress testing (AST). The Accelerated Stress Testing Handbook delineates a core set of AST practices as part of an overall methodology for enhancing hardware product reliability. The techniques presented will teach readers to identify design deficiencies and problems with component quality or manufacturing processes early in the product's life, and then to take corrective action as quickly as possible. A wide array of case studies gleaned from leading practitioners of AST supplement the theory and methodology, which will provide the reader with a more concrete idea of how AST truly enhances quality in a reduced time frame. Important topics covered include: . Theoretical basis for AST. General AST best practices. AST design and manufacturing processes. AST equipment and techniques. AST process safety qualification In this handbook, AST cases studies demonstrate thermal, vibration, electrical, and liquid stress application; failure mode analysis; and corrective action techniques. Individuals who would be interested in this book include: reliability engineers and researchers, mechanical and electrical engineers, those involved with all facets of electronics and telecommunications product design and manufacturing, and people responsible for implementing quality and process improvement programs. | ||
| 530 | _aAlso available in print. | ||
| 538 | _aMode of access: World Wide Web | ||
| 588 | _aDescription based on PDF viewed 12/21/2015. | ||
| 650 | 0 |
_aElectronic apparatus and appliances _xTesting. |
|
| 650 | 0 |
_aElectronic apparatus and appliances _xReliability. |
|
| 650 | 0 | _aEnvironmental testing. | |
| 655 | 0 | _aElectronic books. | |
| 695 | _aAcceleration | ||
| 695 | _aApproximation methods | ||
| 695 | _aAssembly | ||
| 695 | _aAvailability | ||
| 695 | _aBarium | ||
| 695 | _aBenchmark testing | ||
| 695 | _aBibliographies | ||
| 695 | _aBiographies | ||
| 695 | _aBooks | ||
| 695 | _aBusiness | ||
| 695 | _aCentral Processing Unit | ||
| 695 | _aCompanies | ||
| 695 | _aComputer aided software engineering | ||
| 695 | _aComputers | ||
| 695 | _aContainers | ||
| 695 | _aCooling | ||
| 695 | _aDatabases | ||
| 695 | _aDegradation | ||
| 695 | _aEconomics | ||
| 695 | _aElectric shock | ||
| 695 | _aElectronics industry | ||
| 695 | _aEquations | ||
| 695 | _aFailure analysis | ||
| 695 | _aFatigue | ||
| 695 | _aFixtures | ||
| 695 | _aGuidelines | ||
| 695 | _aIndexes | ||
| 695 | _aIndustries | ||
| 695 | _aIntegrated circuit interconnections | ||
| 695 | _aInternet | ||
| 695 | _aLead | ||
| 695 | _aLife estimation | ||
| 695 | _aLiquids | ||
| 695 | _aLoad modeling | ||
| 695 | _aManufacturing | ||
| 695 | _aManufacturing processes | ||
| 695 | _aMaterials | ||
| 695 | _aMathematical model | ||
| 695 | _aMonitoring | ||
| 695 | _aNitrogen | ||
| 695 | _aOptical fibers | ||
| 695 | _aOptimization | ||
| 695 | _aPediatrics | ||
| 695 | _aPortfolios | ||
| 695 | _aPower supplies | ||
| 695 | _aPower system reliability | ||
| 695 | _aPrincipal component analysis | ||
| 695 | _aProbability distribution | ||
| 695 | _aProduct development | ||
| 695 | _aProduction | ||
| 695 | _aProduction facilities | ||
| 695 | _aPrototypes | ||
| 695 | _aQualifications | ||
| 695 | _aRandom access memory | ||
| 695 | _aReliability | ||
| 695 | _aReliability engineering | ||
| 695 | _aReliability theory | ||
| 695 | _aResonant frequency | ||
| 695 | _aRobustness | ||
| 695 | _aSafety | ||
| 695 | _aScanning electron microscopy | ||
| 695 | _aSchedules | ||
| 695 | _aSections | ||
| 695 | _aSensors | ||
| 695 | _aSoftware | ||
| 695 | _aSoldering | ||
| 695 | _aSprings | ||
| 695 | _aStress | ||
| 695 | _aStress measurement | ||
| 695 | _aSurface treatment | ||
| 695 | _aTemperature control | ||
| 695 | _aTemperature distribution | ||
| 695 | _aTemperature measurement | ||
| 695 | _aTemperature sensors | ||
| 695 | _aTerminology | ||
| 695 | _aTest equipment | ||
| 695 | _aTesting | ||
| 695 | _aThermal analysis | ||
| 695 | _aThermal loading | ||
| 695 | _aThermal stresses | ||
| 695 | _aThroughput | ||
| 695 | _aTransient analysis | ||
| 695 | _aVibration measurement | ||
| 695 | _aVibrations | ||
| 700 | 1 |
_aChan, H. Anthony, _d1952- |
|
| 700 | 1 |
_aEnglert, Paul J, _d1960- |
|
| 710 | 2 |
_aJohn Wiley & Sons, _epublisher. |
|
| 710 | 2 |
_aIEEE Xplore (Online service), _edistributor. |
|
| 776 | 0 | 8 |
_iPrint version: _z9780780360259 |
| 856 | 4 | 2 |
_3Abstract with links to resource _uhttps://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5270476 |
| 999 |
_c40217 _d40217 |
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