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Routing in the third dimension : from VLSI chips to MCMs / Naveed A. Sherwani, Siddharth Bhingarde, Anand Panyam.

By: Contributor(s): Material type: TextTextPublisher: Piscataway, New Jersey : IEEE Press, c1995Distributor: [Piscataqay, New Jersey] : IEEE Xplore, [1995]Description: 1 PDF (xviii, 358 pages) : illustrationsContent type:
  • text
Media type:
  • electronic
Carrier type:
  • online resource
ISBN:
  • 9780470546376
Subject(s): Genre/Form: Additional physical formats: Print version:: No titleDDC classification:
  • 621.39/5
Online resources: Also available in print.
Contents:
Preface. Acknowledgments. Introduction. Graphs and Basic Algorithms. Channel Routing and Terminal Assignment. Routing Models. Basic Problems in Routing. Routing Algorithms for the Two-Layer Process. Routing Algorithms for the Three-Layer Process. Routing Algorithms for the Advanced Three-Layered Process. Routing Algorithms for Advanced VLSI and Thin-Film MCMs. Routing Algorithms for General MCMs. Bibliography. Author Index. Subject Index.
Summary: This key text addresses the complex computer chips of tomorrow which will consist of several layers of metal interconnect, making the interconnect within a chip or a multichip module a three dimensional problem. You'll find an insightful approach to the algorithmic, cell design issues in chip and MCM routing with an emphasis on techniques for eliminating routing area.
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Includes bibliographical references (p. 335-350) and indexes.

Preface. Acknowledgments. Introduction. Graphs and Basic Algorithms. Channel Routing and Terminal Assignment. Routing Models. Basic Problems in Routing. Routing Algorithms for the Two-Layer Process. Routing Algorithms for the Three-Layer Process. Routing Algorithms for the Advanced Three-Layered Process. Routing Algorithms for Advanced VLSI and Thin-Film MCMs. Routing Algorithms for General MCMs. Bibliography. Author Index. Subject Index.

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This key text addresses the complex computer chips of tomorrow which will consist of several layers of metal interconnect, making the interconnect within a chip or a multichip module a three dimensional problem. You'll find an insightful approach to the algorithmic, cell design issues in chip and MCM routing with an emphasis on techniques for eliminating routing area.

Also available in print.

Mode of access: World Wide Web

Description based on PDF viewed 12/21/2015.

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