Advances in embedded and fan-out wafer level packaging technologies / (Record no. 40869)
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| fixed length control field | 07144nam a2200577 i 4500 |
| 001 - CONTROL NUMBER | |
| control field | 8726249 |
| 003 - CONTROL NUMBER IDENTIFIER | |
| control field | IEEE |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20230927112401.0 |
| 006 - FIXED-LENGTH DATA ELEMENTS--ADDITIONAL MATERIAL CHARACTERISTICS | |
| fixed length control field | m o d |
| 007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION | |
| fixed length control field | cr |n||||||||| |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 190614s2019 mau ob 001 eng d |
| 010 ## - LIBRARY OF CONGRESS CONTROL NUMBER | |
| Canceled/invalid LC control number | 2018037473 (print) |
| 019 ## - | |
| -- | 1089126008 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9781119313991 |
| Qualifying information | electronic book |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| Canceled/invalid ISBN | 9781119313977 |
| Qualifying information | electronic book |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| Canceled/invalid ISBN | 111931397X |
| Qualifying information | electronic book |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| Canceled/invalid ISBN | 9781119314134 |
| Qualifying information | |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| Canceled/invalid ISBN | 9781119313984 |
| Qualifying information | electronic book |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| Canceled/invalid ISBN | 1119313988 |
| Qualifying information | electronic book |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| Canceled/invalid ISBN | 1119313996 |
| Qualifying information | electronic book |
| 024 7# - OTHER STANDARD IDENTIFIER | |
| Standard number or code | 10.1002/9781119313991 |
| Source of number or code | doi |
| 035 ## - SYSTEM CONTROL NUMBER | |
| System control number | (CaBNVSL)mat08726249 |
| 035 ## - SYSTEM CONTROL NUMBER | |
| System control number | (IDAMS)0b0000648935c166 |
| 040 ## - CATALOGING SOURCE | |
| Original cataloging agency | CaBNVSL |
| Language of cataloging | eng |
| Description conventions | rda |
| Transcribing agency | CaBNVSL |
| Modifying agency | CaBNVSL |
| 082 00 - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 621.39/5 |
| 245 00 - TITLE STATEMENT | |
| Title | Advances in embedded and fan-out wafer level packaging technologies / |
| Statement of responsibility, etc. | edited by Beth Keser and Steffen Kr�ohnert. |
| 264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE | |
| Place of production, publication, distribution, manufacture | Hoboken, New Jersey, USA : |
| Name of producer, publisher, distributor, manufacturer | John Wiley & Sons, Inc., |
| Date of production, publication, distribution, manufacture, or copyright notice | 2019. |
| 264 #2 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE | |
| Place of production, publication, distribution, manufacture | [Piscataqay, New Jersey] : |
| Name of producer, publisher, distributor, manufacturer | IEEE Xplore, |
| Date of production, publication, distribution, manufacture, or copyright notice | [2019] |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | 1 PDF (576 pages). |
| 336 ## - CONTENT TYPE | |
| Content type term | text |
| Source | rdacontent |
| 337 ## - MEDIA TYPE | |
| Media type term | electronic |
| Source | isbdmedia |
| 338 ## - CARRIER TYPE | |
| Carrier type term | online resource |
| Source | rdacarrier |
| 504 ## - BIBLIOGRAPHY, ETC. NOTE | |
| Bibliography, etc. note | Includes bibliographical references and index. |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Formatted contents note | Preface xvii -- List of Contributors xxiii -- Acknowledgments xxvii -- 1 History of Embedded and Fan-Out Packaging Technology 1 /Michael Topper, Andreas Ostmann, Tanja Braun, and Klaus-Dieter Lang -- 2 FO-WLP Market and Technology Trends 39 /E. Jan Vardaman -- 3 Embedded Wafer-Level Ball Grid Array (eWLB) Packaging Technology Platform 55 /Thorsten Meyer and Steffen Krohnert -- 4 Ultrathin 3D FO-WLP eWLB-PoP (Embedded Wafer-Level Ball Grid Array-Package-on-Package) Technology 77 /S.W. Yoon -- 5 NEPES’ Fan-Out Packaging Technology from Single die, SiP to Panel-Level Packaging 97 /Jong Heon (Jay) Kim -- 6 M-Series Fan-Out with Adaptive Patterning 117 /Tim Olson and Chris Scanlan -- 7 SWIFTR Semiconductor Packaging Technology 141 /Ron Huemoeller and Curtis Zwenger -- 8 Embedded Silicon Fan-Out (eSiFOR) Technology for Wafer-Level System Integration 169 /Daquan Yu -- 9 Embedding of Active and Passive Devices by Using an Embedded Interposer: The i2 Board Technology 185 /Thomas Gottwald, Christian Roessle, and Alexander Neumann -- 10 Embedding of Power Electronic Components: The Smart p2 Pack Technology 201 /Thomas Gottwald and Christian Roessle -- 11 Embedded Die in Substrate (Panel-Level) Packaging Technology 217 /Tomoko Takahashi and Akio Katsumata -- 12 Blade: A Chip-First Embedded Technology for Power Packaging 241 /Boris Plikat and Thorsten Scharf -- 13 The Role of Liquid Molding Compounds in the Success of Fan-Out Wafer-Level Packaging Technology 261 /Katsushi Kan, Michiyasu Sugahara, and Markus Cichon -- 14 Advanced Dielectric Materials (Polyimides and Polybenzoxazoles) for Fan-Out Wafer-Level Packaging (FO-WLP) 271 /T. Enomoto, J.I. Matthews, and T. Motobe -- 15 Enabling Low Temperature Cure Dielectrics for Advanced Wafer-Level Packaging 317 /Stefan Vanclooster and Dimitri Janssen -- 16 The Role of Pick and Place in Fan-Out Wafer-Level Packaging 347 /Hugo Pristauz, Alastair Attard, and Harald Meixner -- 17 Process and Equipment for eWLB: Chip Embedding by Molding 371 /Edward Furgut, Hirohito Oshimori, and Hiroaki Yamagishi. |
| 505 8# - FORMATTED CONTENTS NOTE | |
| Formatted contents note | 18 Tools for Fan-Out Wafer-Level Package Processing 403 /Nelson Fan, Eric Kuah, Eric Ng, and Otto Cheung -- 19 Equipment and Process for eWLB: Required PVD/Sputter Solutions 419 /Chris Jones, Ricardo Gaio, and Jose Castro -- 20 Excimer Laser Ablation for the Patterning of Ultra-fine Routings 441 /Habib Hichri, Markus Arendt, and Seongkuk Lee -- 21 Temporary Carrier Technologies for eWLB and RDL-First Fan-Out Wafer-Level Packages 457 /Thomas Uhrmann and Boris Povazay -- 22 Encapsulated Wafer-Level Package Technology (eWLCSP): Robust WLCSP Reliability with Sidewall Protection 471 /S.W. Yoon -- 23 Embedded Multi-die Interconnect Bridge (EMIB): A Localized, High Density, High Bandwidth Packaging Interconnect 487 /Ravi Mahajan, Robert Sankman, Kemal Aygun, Zhiguo Qian, Ashish Dhall, Jonathan Rosch, Debendra Mallik, and Islam Salama -- 24 Interconnection Technology Innovations in 2.5D Integrated Electronic Systems 501 /Paragkumar A. Thadesar, Paul K. Jo, and Muhannad S. Bakir -- References 515 -- Index 521. |
| 506 ## - RESTRICTIONS ON ACCESS NOTE | |
| Terms governing access | Restricted to subscribers or individual electronic text purchasers. |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc. | Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging "FO-WLP" technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,??Advances in Embedded and Fan-Out Wafer Level Packaging Technologies??begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. This valuable text: . Discusses specific company standards and their development results. Relates its content to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies??will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research. |
| 530 ## - ADDITIONAL PHYSICAL FORM AVAILABLE NOTE | |
| Additional physical form available note | Also available in print. |
| 538 ## - SYSTEM DETAILS NOTE | |
| System details note | Mode of access: World Wide Web |
| 588 ## - SOURCE OF DESCRIPTION NOTE | |
| Source of description note | Description based on online resource; title from digital title page (viewed on May 17, 2019). |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Chip scale packaging. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Integrated circuits |
| General subdivision | Wafer-scale integration. |
| 655 #0 - INDEX TERM--GENRE/FORM | |
| Genre/form data or focus term | Electronic books. |
| 700 1# - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Keser, Beth, |
| Dates associated with a name | 1971- |
| Relator term | editor. |
| 700 1# - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Kroehnert, Steffen, |
| Dates associated with a name | 1970- |
| Relator term | editor. |
| 710 2# - ADDED ENTRY--CORPORATE NAME | |
| Corporate name or jurisdiction name as entry element | IEEE Xplore (Online Service), |
| Relator term | distributor. |
| 710 2# - ADDED ENTRY--CORPORATE NAME | |
| Corporate name or jurisdiction name as entry element | Wiley, |
| Relator term | publisher. |
| 776 08 - ADDITIONAL PHYSICAL FORM ENTRY | |
| Relationship information | Print version: |
| Title | Advances in embedded and fan-out wafer level packaging technologies. |
| Edition | 1st edition. |
| Place, publisher, and date of publication | Hoboken, NJ, USA : Wiley, [2018] |
| International Standard Book Number | 9781119314134 |
| Record control number | (DLC) 2018034374 |
| 856 42 - ELECTRONIC LOCATION AND ACCESS | |
| Materials specified | Abstract with links to resource |
| Uniform Resource Identifier | <a href="https://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=8726249">https://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=8726249</a> |
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